Method of forming a metal wiring in a semiconductor device,申请号KR20000063161-传众专利搜索

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发明名称	Method of forming a metal wiring in a semiconductor device
摘要
申请公布号	KR100671610(B1)	申请公布日期	2007.01.18
申请号	KR20000063161	申请日期	2000.10.26
申请人		发明人
分类号	C23C16/18;H01L21/28;H01L21/285;H01L21/768	主分类号	C23C16/18
代理机构		代理人
主权项
地址

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