| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having the configuration of an antenna advantageous to miniaturization without changing the number of processes or communication distances. <P>SOLUTION: The semiconductor device capable of achieving the items has a substrate, a tag including a thin film device provided on the substrate, a first antenna, and a second antenna. The first and the second antennae are formed in different layers isolated by an insulating film, the first antenna and the second antenna are partially connected electrically, the first antenna is formed of the same material and in the same layer as in the wiring that is connected to the thin film device, and the second antenna is formed in a layer different from the wiring that is connected to the thin film device. <P>COPYRIGHT: (C)2007,JPO&INPIT |
