| 摘要 |
PROBLEM TO BE SOLVED: To enhance an electric characteristic of a thin film probe having a probe needle formed by a production technique of a semiconductor integrated circuit device. SOLUTION: A wire 23G connected electrically to a reference potential (grounding potential) is arranged between a plurality of wires 23S used for transmitting a signal, out of the plurality of wires 23 formed in a thin sheet, and a pattern is formed to be extended to the vicinity of the probes 7A, 7B as much as possible. The wires 23P of a plurality of electric power source systems connected electrically to an electric power source in the same line are formed into a pattern connected each other, out of the plurality of wires 23. COPYRIGHT: (C)2007,JPO&INPIT
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