| 摘要 |
[PROBLEMS] Since conventionally, active parts and passive parts of an electronic component are arranged together on one side of a ceramic substrate, the active parts and the passive parts interfere electromagnetically with each other. Furthermore, conventionally layer separation may occur because resin is thermally set when a resin layer is bonded to the ceramic substrate and a remarkable variation in the volume of the resin layer occurs before and after thermosetting with respect to the ceramic substrate. [MEANS FOR SOLVING PROBLEMS] An electronic component (10) of the invention comprises active chip parts (12) and passive chip parts (13) sealed in first and second resin layers (14, 15) on the upper and lower surfaces of a core substrate (11), respectively. A shielding metal film (16) is formed on the upper surface of the first resin layer (14), and a first via hole conductor (17) connecting the circuit pattern of the core substrate (11) to the shielding metal film (16) is formed in the metal film. An external terminal electrode (18) is formed on the lower surface of the second resin layer (15), and a second via hole conductor (19) connecting the external terminal electrode (18) to circuit pattern of the core substrate (11) is formed in the external terminal electrode. ® KIPO & WIPO 2007 |
