| 摘要 |
PROBLEM TO BE SOLVED: To provide a micro structure having improved reliability of hermetic sealing. SOLUTION: The micro structure is equipped with: a first substrate 1 having a recessed part; and a second substrate 2 which is composed of a multi-layer substrate, connected to the first substrate 1 to seal the recessed part and forms a sealing space 10 between the substrate 1 and the second substrate 2. First and second conductive patterns 31, 32 and a via hole 2a exposing a third conductive pattern 33 provided inside of the second substrate 2 are provided respectively. The first and second conductive patterns 31, 32 are mutually coupled through a forth conductive pattern 34 and the third conductive pattern 33 provided in the via hole 2a. The reliability of the hermetic sealing is more improved compared to the case where the first conductive pattern 31 and the second conductive pattern 32 are electrically connected by providing a through-hole passing through the second substrate 2 and through the conductive pattern provided on the inner surface of the through-hole. COPYRIGHT: (C)2007,JPO&INPIT
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