| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition for a semiconductor device, having excellent characteristics of various kinds and, especially, excellent in adhesion and resistance to deterioration by heat, and to provide an adhesive sheet for the semiconductor device. SOLUTION: The adhesive composition for the semiconductor device comprises an epoxy resin (A), a phenol resin (B), and a vinyl copolymer (C) which has ethylene and an unsaturated carboxylic acid having a functional group reactive with the epoxy resin (A) or a derivative of the carboxylic acid as monomer components, wherein the composition has a minimum melt viscosity in a range of 400-50,000 Pa×s when the composition is subjected to measurement of kinematic viscoelasticity before cured. COPYRIGHT: (C)2007,JPO&INPIT
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