| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sealing structure of an electronic part and a manufacturing method thereof where an installation area is reduced and an electronic appliance is miniaturized by simplifying a structure and reducing the number of parts. <P>SOLUTION: The sealing structure seals light-emitting devices (electronic parts) 20-1, 2 and 3 fitted onto a flexible circuit board 10 with sealing resin 30-1, 2 and 3. The outer peripheral side faces 31 of the sealing resin 30-1, 2 and 3 are molded surfaces. The outer peripheral side faces 31 are nearly vertical to the surface of the flexible circuit board 10. The plurality of light-emitting devices 20-1, 2 and 3 are installed in parallel, and shielding plate insertion grooves 35 for partitioning the sealing resin 30-1, 2 and 3 are formed between the sealing resin 30-1, 2 and 3 sealing the respective light-emitting devices 20-1, 2 and 3. <P>COPYRIGHT: (C)2007,JPO&INPIT |
