发明名称 SUBSTRATE TRANSFER APPARATUS AND SEMICONDUCTOR SUBSTRATE MANUFACTURING APPARATUS MOUNTED WITH THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a transfer apparatus for transferring a semiconductor wafer without deteriorating transfer throughput in all conditions such that there is a vacant slot having no wafer in a wafer storage case, or that the number of stored wafers in the wafer storage case is not a multiple of the number of collectively transferable wafers, etc. SOLUTION: This semiconductor substrate transfer apparatus comprises at least one arm, and N pieces of end effectors for holding at least one semiconductor substrate. When substrate transfer processing is started, at least one desired end effector is selected from among the N end effectors in accordance with a substrate distribution state in a transfer source and the vacancy state of the slot in the transfer destination, the selected end effector and the other effectors are rotated independently from one another with respect to the arm, and the semiconductor substrate is transferred using the selected end effector. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007005582(A) 申请公布日期 2007.01.11
申请号 JP20050184365 申请日期 2005.06.24
申请人 ASM JAPAN KK 发明人 TAKIZAWA MASAHIRO;SUWADA MASAE;WADA TAKASHI
分类号 H01L21/677;B65G49/07;H01L21/67 主分类号 H01L21/677
代理机构 代理人
主权项
地址