发明名称 CCD SOLID-STATE IMAGING DEVICE AND METHOD OF MANUFACTURING SAME
摘要 PROBLEM TO BE SOLVED: To achieve a reduced electric power consumption of a CCD solid-state imaging device. SOLUTION: The CCD solid-state imaging apparatus includes: a photoelectric conversion device; a plurality of first transfer paths (vertical transfer paths) extending in the first direction; and a second transfer path (horizontal transfer path) extending in the second direction, on a surface of a semiconductor 30. The imaging apparatus includes: a plurality of first layer transfer electrode films each discretely formed on the first transfer paths and the second transfer path; and a second layer transfer electrode film formed between the first electrode films with its both ends of the second electrode film laminated to the edge ends of the first electrode film through an insulating film. A thickness (b) of an insulating film 34 between the first layer transfer electrode film 32, and the second layer transfer electrode film 35 constituting the first transfer path shown in Fig. (a) is made thinner than a thickness (a) of an insulating film 37 between the first layer transfer electrode film 32 and the second layer transfer electrode film 35 constituting the second transfer path shown in Fig. (b). COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007005693(A) 申请公布日期 2007.01.11
申请号 JP20050186488 申请日期 2005.06.27
申请人 FUJIFILM HOLDINGS CORP 发明人 UIE SHINJI
分类号 H01L27/148;H01L21/339;H01L29/762;H04N5/335;H04N5/369;H04N5/372 主分类号 H01L27/148
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