发明名称 |
Laminate damping base material, and damping structure with stack of this base material |
摘要 |
A damping structure which dispenses of the connection of a resistor used for a conventional damping structure and undergoes diverse molding processings with a simpler structure, and a laminate damping base material constituting such a damping structure. A laminate damping base material made of a piezoelectric ceramic material or piezoelectric polymer material and a conductive fiber-reinforced plastic (FRP) composition is prepared. One to a plurality of this base material are stacked to constitute a first damping structure. A second damping structure is constituted by stacking at least a layer of piezoelectric polymer film or piezoelectric ceramic thin film between a multilayer laminate that is a laminate of conductive laminate FRP base materials.
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申请公布号 |
US7160607(B2) |
申请公布日期 |
2007.01.09 |
申请号 |
US20040491247 |
申请日期 |
2004.03.30 |
申请人 |
KURIMOTO, LTD.;KIMURA TOSHIO;KURIMOTO LTD |
发明人 |
TANIMOTO TOSHIO |
分类号 |
B32B27/04;E04B1/82;B32B7/02;B32B18/00;B32B27/14;B32B27/20;E04C2/20;F16F15/00;F16F15/02 |
主分类号 |
B32B27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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