发明名称 Laminate damping base material, and damping structure with stack of this base material
摘要 A damping structure which dispenses of the connection of a resistor used for a conventional damping structure and undergoes diverse molding processings with a simpler structure, and a laminate damping base material constituting such a damping structure. A laminate damping base material made of a piezoelectric ceramic material or piezoelectric polymer material and a conductive fiber-reinforced plastic (FRP) composition is prepared. One to a plurality of this base material are stacked to constitute a first damping structure. A second damping structure is constituted by stacking at least a layer of piezoelectric polymer film or piezoelectric ceramic thin film between a multilayer laminate that is a laminate of conductive laminate FRP base materials.
申请公布号 US7160607(B2) 申请公布日期 2007.01.09
申请号 US20040491247 申请日期 2004.03.30
申请人 KURIMOTO, LTD.;KIMURA TOSHIO;KURIMOTO LTD 发明人 TANIMOTO TOSHIO
分类号 B32B27/04;E04B1/82;B32B7/02;B32B18/00;B32B27/14;B32B27/20;E04C2/20;F16F15/00;F16F15/02 主分类号 B32B27/04
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