| 摘要 |
<p>An apparatus and a method for measuring overlay are provided to reduce an overlay measuring time by decreasing a wafer transfer distance. An apparatus for measuring overlay includes a stage for supporting a wafer, a flat zone detecting unit for detecting a flat zone of the wafer at one side of the stage, an overlay measuring unit(140) for measuring the overlay between a reference overlay mark and an object overlay mark at the other side of the stage, a first driving unit and a second driving unit. The first driving unit(122) rotates the stage when the flat zone detecting unit detects the flat zone of the wafer. The second driving unit(124) drives the stage in X and Y axis directions in order to locate the overlay measuring unit over overlay marks of the wafer when the overlay measuring unit measures the overlay.</p> |
