Elektronisches Bauteil mit einem Halbleiterchip, Verfahren zu seiner Herstellung und Verfahren zur Herstellung eines Nutzens

摘要

Electronic component comprises a semiconductor chip (2) arranged on a substrate (4) made from plastic (3) and embedded in a plastic housing (6). The plastic of the substrate has a glass transition temperature region (Tg1) which is lower than the glass transition temperature region (Tg2) of the plastic housing. An Independent claim is also included for a process for the production of several electronic components.