| 摘要 |
The present invention is made with the aim of suppressing heat generation and thus reducing voltage drop, regarding a socket comprising probes to be connected to an electronic device such as an IC package. This is achieved by the socket 6 comprising heatsink components (heatsink plates 74, 76, 201 , and 202 ) disposed adjacent to probes 32, 34, 36 so that the heatsink components move heat of the probes to a heatsink area 84 . The socket 6 includes an air layer AL encompassing at least heat-generating portions 104 and 106 in the probes. The heat-generating portions are extended to the side of the socket 6 and heatsink fins (heatsink slit 86 ) are formed at its end portion. The socket 6 comprises a first probe 32 to be connected with pressure between an electrode (electrode pad 26 ) of signal system in the electronic device (IC package 4 ) and an electrode (electrode pad 44 ) of a signal extraction board 38 corresponding to the signal system; and second probes 34 and 36 to be connected with pressure between electrodes (electrode pads 28 and 30 ) of power system in the electronic device and an electric conductor (conductive plates 40 and 42 ) corresponding to the power system.
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