| 摘要 |
In an electric connecting device, a plurality of pins are disposed in a ceramic substrate in such a manner that they project from one surface thereof, and a resin substrate having a plurality of electrically conductive sections electrically connected to these pins is disposed on the other surface of the ceramic substrate. A socket device is provided with a plurality of recesses which open to the surface on the ceramic substrate side to individually receive the pins, and a plurality of pairs of grip members for releasably gripping the pins individually received in the recesses, whereby the ceramic substrate is joined to the socket device, the latter being joined to a wiring board. |
