PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT USING THE SAME, RESIST PATTERN FORMING METHOD AND METHOD FOR PRODUCING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition and a photosensitive element having satisfactory sensitivity, and to provide a resist pattern forming method excellent in work efficiency and useful to achieve higher density of printed wiring and a method for producing a printed wiring board useful to achieve higher density of printed wiring.

SOLUTION: The photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group within a molecule and (C) a photopolymerization initiator, wherein the component (C) contains at least one photopolymerization initiator selected from the group of imidazole dimers each having substituents each having an alkylene glycol group.

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