发明名称 MANUFACTURING METHOD OF ELECTRICAL COMPONENT MOUNTING BOARD
摘要 PROBLEM TO BE SOLVED: To improve the soldering reliability of an electrical component, reduce the manufacturing cost of an electrical component mounting board, simplify installation, and achieve reduction in size and weight. SOLUTION: In the manufacturing method of an electrical component mounting board 17 which mounts an electrical component 1 on a substrate 5 by pre-soldering and fully soldering of terminals 3 and 9 on electrical components 7 and 1, respectively, an electrical component mounting board 4 mounting the primary electrical component 1 with its terminal 3 pre-soldered to the substrate 5 and the secondary electrical component 7 of which the terminal 9 is not pre-soldered are mounted on a common pallet 11. Then, the terminal 3 on the primary electrical component 1 and the terminal 9 on the secondary electrical component 7 are immersed into a common soldering bath. The terminal 3 on the primary electrical component 1 is fully soldered, while the terminal 9 on the secondary electrical component 7 is pre-soldered. In such a method, the secondary electrical component 7 is used as the primary electrical component 1. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006351869(A) 申请公布日期 2006.12.28
申请号 JP20050176699 申请日期 2005.06.16
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 TSUJITA TORU
分类号 H05K3/34 主分类号 H05K3/34
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