| 摘要 |
A thermal module includes a thermal body, at least one thermal tube, and a holding part. The thermal tube includes a heat receiving portion and condenser terminals connecting with the thermal body, wherein the heat receiving portion has a plane. The holding part includes a plate body with trenches therein, wherein the trenches has through holes and a connecting part formed between the through holes. The through holes are used for receiving and holding the heat receiving portion of the thermal tube. The connecting part are connected with a top surface of the heat receiving portion. Thus, thermal transfer is speed up, and the thermal module is assembled without a thermal treatment which causing a copper ruduction reaction, resulting in improvement of thermal conduction, reduction of cost, and manufacturing time saving.
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