| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a gold alloy wire for a bonding wire having high initial junction property, high junction reliability, the high circularity of a compression bonding ball, high linearity, high resin flow resistance and specific resistance. <P>SOLUTION: The gold alloy wire for the bonding wire contains one or two kinds of Pt and Pd of lower than 500-1,000 ppm in total, Ir of 1-100 ppm, Ca of more than 30-100 ppm, and Eu of more than 30-100 ppm, contains Be of 0.1-20 ppm as necessary, contains one or more kinds selected from La, Ba, Sr and Bi of 30-100 ppm in total as necessary, contains Ag of 1-10 ppm as necessary, and has the balance of component composition comprising Au and inevitable impurities. <P>COPYRIGHT: (C)2007,JPO&INPIT |
