CURABLE COMPOSITION

摘要

A curable resin composition which forms a continuous phase and a dispersoid at ordinary temperature, characterized in that the continuous phase is liquid at ordinary temperature and comprises (a) an epoxy compound having two or more epoxy groups per molecule and that the dispersoid comprises (b) a compound which is present as solid particles in the continuous phase at ordinary temperature and has two or more amino groups per molecule (preferably an aromatic amine compound having a benzoxazole structure). The composition is a curable epoxy composition of the one-pack type having excellent storage stability and giving a cured article with satisfactory material properties.