Acidic treatment liquid and method of treating copper surfaces

摘要

The present invention relates to a solution and to a method of treating copper surfaces, the copper surfaces being brought into contact with an acidic treatment liquid which contains hydrogen peroxide and at least one five-membered heterocyclic compound as well as additionally at least one microstructure modifying agent selected from the group comprising thioles A, disulfides B, sulfides C and thioamides D having the following respective general formulae: wherein R¹ and R²=alkyl, alkenyl, aryl, aralkyl, especially benzyl, cycloalkyl and the derivatives thereof and R³=R¹, R¹-O, R¹-S, amino or substituted amino, wherein R¹ and R² may especially be phenyl or substituted phenyl.