| 摘要 |
A polymerizable composition which comprises component (A) of a (meth) acrylic monomer, component (B) of a (meth)acrylic polymer having at least one functional group capable of undergoing a cross-linking reaction in a molecule thereof, component (C) of a (meth)acrylic oligomer having a functional group capable of undergoing a cross-linking reaction at one terminal of a molecule thereof, component (D) of a cross-linking agent having a functional group capable of undergoing a cross-linking reaction, component (E) of a photopolymerization initiator and/or a thermal polymerization initiator, and component (F) a filler having good thermally conductivity; and a (meth)acrylic thermally conductive sheet comprising a pressure-sensitive adhesive layer prepared by polymerizing and cross-linking the polymerizable composition. The above thermally conductive sheet is excellent in softness, adhesiveness and the resistance to bleeding, and thus allows the release of heat with good efficiency from an heat generating article such as an electronic device.
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