| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition suitably usable for e.g. producing circuit boards, excellent in adhesivity and processability, and also excellent in heat resistance, resin fluidity and dielectric properties in GHz zone, and to provide its typical application technology. SOLUTION: The thermosetting resin composition essentially comprises (A) a polyimide resin component, (B) an epoxy curing agent component, (C) an epoxy resin component and (D) a curing promoter component, wherein the component B contains at least one active ester compound having in one molecule two or more active ester groups. Thereby, this thermosetting resin composition and the resin obtained by curing the composition can be favorably imparted with various properties including adhesivity, processability, heat resistance, resin fluidity and dielectric properties in GHz zone in a well-balanced manner. COPYRIGHT: (C)2007,JPO&INPIT
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