| 摘要 |
Disclosed is a substrate processing device capable of reducing damage of a peripheral member when a power supply member generates heat. The substrate processing device includes: a resistance heating element and a high-frequency electrode, to which a voltage is applied; a power supply member for a resistance heating element, and a power supply member for a high-frequency electrode, which supply power to the resistance heating element and the high-frequency electrode, respectively; a peripheral member disposed close to circumferences of these power supply members; and heat insulators arranged between the power supply members and the peripheral member and having heat resistance to a temperature at least higher than 250° C.
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