| 摘要 |
A sputter system is provided to minimize defective products due to a particle by vertically carrying a substrate. A sputter system includes a plurality of chambers. After a substrate is vertically stood, it is carried in one direction. The substrate stops and a sputter process is performed. While a large area substrate is moved in the sputter system, it stops at a process chamber and a film is formed. The process chamber moves only the substrate using a carrier, a static chuck, or an air cushion. The sputter system includes a load lock chamber(87), a buffer chamber(86), a process chamber(83) having a cathode(85), a rotation chamber(82), and an unload chamber(88). The substrate is vertically put in the load lock chamber in an atmosphere pressure state, it makes the load lock chamber become in a low vacuum state and the substrate is carried to the buffer chamber.
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