METHOD AND APPARATUS FOR INSPECTING MARKING OF SEMICONDUCTOR PACKAGE

摘要

A method and apparatus for inspecting a marking of a semiconductor package is disclosed, which quickly carries out a marking inspection of a semiconductor package, and increases the accuracy of the inspection. The method includes: a) acquiring character string information of a semiconductor package of a target lot to be inspected, and storing the acquired character string information as reference character string information; b) capturing a character pattern printed on an incoming semiconductor package, and acquiring image information of the incoming semiconductor package/ c) displaying the acquired image information to allow a user to visually recognize the acquired image information; d) detecting character string information from the displayed image information according to a setup signal, determining the displayed semiconductor-package image information to be reference image information of a corresponding lot if the detected character string information is equal to the pre- stored character string information; and e) classifying a corresponding semiconductor package into a defective-package storage unit if the determined reference image information is different from image information of sequentially-incoming semiconductor packages.