| 摘要 |
A method and an apparatus for inspecting an in-tray of a semiconductor package are provided to reduce the inspection time by effectively dividing an image of an object to be tested according to the kind of the object. An apparatus for inspecting an in-tray of a semiconductor package includes a main body(10), a loading unit(21), a buffer(25), a defective tray storage(23), and an unloading unit(24). Trays containing an object to be tested therein are loaded on the loading unit. The buffer temporarily stores buffer trays, which contain the tested semiconductor packages therein. The trays, which contain defective semiconductor packages, are stacked on the defective tray storage. Unloading trays, which contain normal semiconductor packages, are stacked on the unloading unit. |
