| 摘要 |
PROBLEM TO BE SOLVED: To reliably prevent land exfoliation, and to reduce elution of copper. SOLUTION: In a printed wiring board provided with a through-hole 12 and a land 13 at an insulating member, the whole of the outer periphery of the land 13 is coated with a resist 14, and a coating width L1 of the resist to the lands 13 and a separation distance L2 of the resist 14 from the opening end of the through-hole 12 are respectively set to be≥0.15 mm. COPYRIGHT: (C)2007,JPO&INPIT
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