发明名称 ETCHING SYSTEM
摘要 <P>PROBLEM TO BE SOLVED: To provide a wet etching system which has a recycle system for effectively treating the impurities produced by an etching reaction and is excellent in reliability, by which the object to be treated is inexpensively etched with high quality, and which contributes to effective use of resources and environmental preservation. <P>SOLUTION: The wet etching system is used for etching the object to be treated such as a LCD glass substrate 50. A waste etching liquid 21 containing the impurities generated by the etching reaction is treated according to such a recycle flow chart that the waste etching liquid is subjected to precipitation/separation treatment, chemical treatment, filtration treatment and reverse osmosis membrane treatment in this order so that the unwanted material-removed or unwanted material-volume-reduced etching liquid is recycled to an etching step. The precipitation/separation treatment is performed in a precipitation tank 2. The chemical treatment is performed in an agitated reaction tank 3. The filtration treatment is performed by using an MF (microfiltration) membrane or a UF (ultrafiltration) membrane 10. The reverse osmosis membrane treatment is performed by using a reverse osmosis membrane 11. The etchant in a suspension 4 is treated with a chemical in a neutralization tank 5 and a part of the treated etchant is recovered. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006326444(A) 申请公布日期 2006.12.07
申请号 JP20050151759 申请日期 2005.05.25
申请人 SONY CORP 发明人 ISHIYAMA HIROSHI;NANASE SHINGO;YOSHIOKA TETSUYA
分类号 C02F9/00;B01D61/02;B01D61/04;B01D61/14;B01D61/58;C02F1/44;C02F1/58;C03C15/00 主分类号 C02F9/00
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