| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition and a prepreg for printed wiring boards compatible with lead-free soldering, and to provide a metal-clad laminate using the same. SOLUTION: The resin composition comprises an epoxy resin, a curing agent, a curing accelerator, and a talc subjected to special high-temperature treatment. Preferably, the talc subjected to special high-temperature treatment is a hydrophilic short columnar crystal which is treated at 1,000-1,200°C and has a specific gravity of 3.2-3.3. COPYRIGHT: (C)2007,JPO&INPIT |
