Transfer mechanism and transfer method of semiconductor package

摘要

A semiconductor package transfer mechanism and a semiconductor package transfer method are disclosed. The semiconductor package transfer mechanism includes a plurality of pickup units, which are movable along a shaft extending in one direction and operated individually from each other, and a vision inspection apparatus installed across a moving route of the pickup unit in order to inspect defects of the semiconductor packages transferred thereto by means of the pickup units. The pickup units pick up a predetermined amount of semiconductor packages adapted for one-time photographing capacity of the vision inspection apparatus and instantly transfer the semiconductor packages to the vision inspection apparatus. Time delay and waiting time for the semiconductor packages are significantly reduced during the process of the handler system, thereby significantly improving the transfer efficiency and vision inspection efficiency.