| 摘要 |
PROBLEM TO BE SOLVED: To make excellent heat radiation characteristics and/or current characteristics, and to achieve weight reduction and high density. SOLUTION: A plurality of piece bodies having heat radiation characteristics and/or current characteristics and an insulating resin formed in the periphery are arranged at an internal layer, and the insulating layer and a conductor layer equipped with a land are laminated on at least either of the upper and lower faces so that a multilayer printed wiring board can be configured. This method for manufacturing the multilayer printed wiring board comprises: a step for laminating the insulating layer and a conductor layer on at least either of the upper and lower faces with a multilayer printed wiring board, where the land is connected through an in-layer connection to the piece bodies (a core substrate constituted of a plurality of piece bodies having heat radiation characteristics and/or current characteristics and an insulating resin part formed in the periphery) as the center; a step for forming the land part in the conductor layer; and a step for connecting the land part to the piece bodies at the inter-layer connection part. COPYRIGHT: (C)2007,JPO&INPIT |
