PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT EMPLOYING THE SAME, METHOD OF FORMING RESIST PATTERN, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD

摘要

A photosensitive resin composition which comprises (A) a binder polymer, (B) a photopolymerizable compound having at least one polymerizable, ethylenically unsaturated group per molecule, and (C) a photopolymerization initiator, characterized in that the ingredient (A) comprises a polymer comprising units of a compound represented by the following general formula (I): CH<SUB>2</SUB>=C(L<SUP>1</SUP>)-COOL<SUP>2</SUP> (I) [wherein L<SUP>1</SUP> represents hydrogen or methyl and L<SUP>2</SUP> represents C<SUB>2-20</SUB> alkyl] and the ingredient (B) comprises a compound represented by the following general formula (II): [wherein R<SUP>1</SUP> represents hydrogen or methyl; R<SUP>2</SUP> represents C<SUB>3-20</SUB> alkyl having two or more, tertiary or higher carbon atoms; X represents C<SUB>2-6</SUB> alkylene; and n is an integer of 1-20].