| 摘要 |
An apparatus for fabricating a semiconductor device is provided to reduce contamination of process fluids by supplying each process fluid to the back surface of a semiconductor substrate through each rear nozzle. A chuck on which a semiconductor substrate is placed is installed in a process chamber. A rear nozzle part(600) includes a plurality of rear nozzles(630a,630b,630c) for supplying a plurality of fluids to the back surface of the semiconductor substrate. A fluid supply apparatus for a rear nozzle supplies the plurality of fluids to the plurality of rear nozzles. The plurality of rear nozzles are installed at regular intervals wherein each rear nozzle includes a plurality of injection holes(640).
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