| 摘要 |
A card type wireless device, an antenna coil, and a method for manufacturing a communication module are provided to prevent a soldering failure from a substrate side pad by blocking a distortion of a coil side terminal unit due to a thermal stress. In an antenna coil, an air-core type flat coil body(10) has thickness in an axial direction of a coil body(10). A coil case(20) is formed of resin. A thickness of the coil body(10) is smaller than a radius of a circle, wherein an area of the circle is identical with an area of a region surrounded by an outline of a projected coil body. The coil case(20) has a ring shape corresponding to the coil body(10). The coil case(20) includes a coil receiving space(24) for receiving the coil body(10). Each of reinforce frames(30) is formed integrally with the coil case(20) along a circumference direction of the coil case(20). The reinforce frame(30) is made of a material, which has Young's modulus higher than that of resin of the coil case(20).
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