| 摘要 |
A copper strike plating method that can shorten pretreatment step as short as possible when applying a copper strike plating onto a substrate heat-treated and made of a copper alloy, and also can form a copper strike plating layer capable of properly satisfying adhesive property and heat resistance to the substrate is provided. A copper strike plating method comprises the steps of: performing a degreasing process and an activating process on the surface of a substrate made of a heat-treated copper alloy; and performing a copper strike plating on the surface of the substrate after performing the degreasing process and the activating process, wherein, in the copper strike plating, a pulse current in the form of a series of pulses is applied to the substrate only on a polarity side from which a copper metal is deposited on the surface of the substrate such that a crystal plane as a crystal face showing a maximum value of an X-ray diffraction intensity of a copper strike plating layer formed on the surface of the substrate corresponds to a (111) plane showing a maximum value of an X-ray diffraction intensity of a copper layer in which metal crystals made of copper are filled most densely. |
