| 摘要 |
A wet cleaning apparatus is provided to reduce a time interval of a wet cleaning process by changing the structure of a cleaning part in a manner that only one bath is used to function as a transfer bath in which a wafer stands by and a first bath for cleaning foreign substances on a processing arm. A wafer is loaded by a loader(51). A cleaning part(65) is disposed as a unit for wet-cleaning the wafer loaded by a loader, including a first QDR(quick dump rinse) bath(57), a chemical bath(60) and a second QDR bath(63) which are sequentially disposed. A processing arm(77) transfers the wafer to each cleaning part according to a process progression. The wafer wet-cleaned by the cleaning part is unloaded by an unloader(73). The wafer stands by in the first QDR bath to which a cleaning agent is supplied to wet-clean the foreign substances on the standing-by wafer and the processing arm. Chemicals are stored in the chemical bath to wet-clean the wafer. A cleaning agent is stored in the second QDR bath to wet-clean the foreign substances on the wafer and the processing arm. A final rinse bath(67) is additionally installed at one side of the second QDR bath in the cleaning part to finally clean the wafer.
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