发明名称 MANUFACTURING METHOD OF DIAMOND PART
摘要 PROBLEM TO BE SOLVED: To provide a method of separating and recovering a diamond part from a base material molding substrate in a short time even if the size of the diamond part is large or its shape is complicated, when a diamond part is manufactured using a base material molding substrate. SOLUTION: In this manufacturing method, when a middle sacrificing layer is coated on the base material molding substrate, and the diamond layer is accumulated on it, then the diamond part is separated by removing the middle sacrificing layer by etching, a porous material is used as the base material molding substrate or an ultrasound vibration is applied to the etching solution, and the middle sacrificing layer can also be removed by electrolysis immersing it in an electrolytic solution. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006321709(A) 申请公布日期 2006.11.30
申请号 JP20060107051 申请日期 2006.04.10
申请人 SUMITOMO ELECTRIC IND LTD 发明人 SEKI YUICHIRO;IMAI TAKAHIRO
分类号 C30B29/04 主分类号 C30B29/04
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