| 摘要 |
It is an object of the present invention to provide an improved structure having an adequate strength to satisfy a requirement of making a thin electro-optical panel. The electro-optical panel forms a sealing area having an electro-optical functional section between the support substrate and the sealing member. The support substrate has a lead-out area containing an area for forming lead-out wiring extending from the sealing area and for connecting or mounting the driving means (IC chip, flexible substrate and the like) to the lead-out wiring. The sealing member has protruding reinforcement sections protruding from the sealing area S on to the lead-out area. The support substrate and the sealing member are bonded together through an adhesive layer, thereby forming an adhesive area surrounding the sealing member. It is another object of the present invention to provide an improved process of producing a plurality of self-emission panels formed by cutting a mother panel into a plurality of unit panels, to prevent lead-out wiring portions from being wounded during the cutting process, thereby improving the yield of production. A further object of the invention is to improve the efficiency of inspection step, thereby improving the productivity of manufacturing process. A mother self-emission panel comprises a mother support substrate having formed thereon a plurality of self-emission sections, and a mother sealing member having arranged thereon a plurality of sealing sections corresponding to the plurality of self-emission sections. When the mother support substrate and the mother sealing member are bonded together, a plurality of sealing areas will be formed to seal the plurality of self-emission sections corresponding to the plurality of sealing sections. The mother support substrate has a plurality of lead-out areas having formed thereon a plurality of lead-out wiring portions extending from the plurality of self-emission sections to the outsides of the sealing areas. The mother sealing member has a plurality of hole processing portions for exposing the lead-out wiring portions.
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