| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a process for manufacturing a multilayer printed wiring board employing conductive paste for interlayer connection in which the gap between a non-through interlayer contact hole and a through interlayer contact hole is extremely small. <P>SOLUTION: In the process for manufacturing a multilayer printed wiring board, position confirming through holes 24 and 25 are bored in an interlayer insulation adhesive sheet in the vicinity of inner via holes 20 and 21 for confirming positional correction with reference to an origin at a desired position of a four layer copper-clad laminate having conductive patterns 11 and 12 when a through hole filled with conductive paste is bored. A copper foil where the positional relation of the inner via holes 20 and 21 for confirming positional correction when a through hole filled with conductive paste is bored is applied to an X-ray transmitting position confirming machine or the interlayer insulation adhesive sheet 16 is subjected to counterboring for the position confirming through holes 24 and 25 and the interlayer insulation adhesive sheet 16 and then it can be confirmed visually or a desired method. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
