| 摘要 |
PROBLEM TO BE SOLVED: To prevent air bubbles from being taken in between a protective film and a solder resist layer by making the protective film follow up a circuit swollen shape, when the protective film is laminated on a liquid solder resist layer. SOLUTION: A manufacturing method for a printed circuit board with resist includes the processes of forming liquid solder resist layers 11 and 21 on at least one surface of a printed circuit board 1, and laminating protective films 12 and 22 on the solder resist layers 11 and 21. A laminate 10, formed by laminating the printed circuit board 1, solder resist layers 11 and 21, and protective films 12 and 22 in this order, is deaerated through pressure reduction, and the solder resist layers 11 and 21 are pressed uniformly within a plane, under reduced pressure while being sandwiched between the printed circuit board 1 and protective films 12 and 22 to be laminated. COPYRIGHT: (C)2007,JPO&INPIT
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