| 摘要 |
A heat conductive silicone composition is provided, which includes (A) an organopolysiloxane having the formula (1): <?in-line-formulae description="In-line Formulae" end="lead"?>{(CH<SUB>2</SUB>-CH)R<SUP>1</SUP><SUB>2</SUB>SiO<SUB>1/2</SUB>}<SUB>L</SUB>(R<SUP>1</SUP>SiO<SUB>3/2</SUB>)<SUB>m</SUB>(R<SUP>1</SUP><SUB>2</SUB>SiO)<SUB>n</SUB>{O<SUB>1/2</SUB>SiR<SUP>1</SUP><SUB>2</SUB>-R<SUP>2</SUP>-SiR<SUP>1</SUP><SUB>(3-a)</SUB>(OR<SUP>3</SUP>)<SUB>a</SUB>}<SUB>o</SUB> ( 1 )<?in-line-formulae description="In-line Formulae" end="tail"?> wherein R<SUP>1 </SUP>represents monovalent hydrocarbon groups, R<SUP>2 </SUP>represents an oxygen atom or a bivalent hydrocarbon group, R<SUP>3 </SUP>represents an alkyl group, alkoxyalkyl group, alkenyl group, or acyl group, L and o represent numbers from 1 to 10, m represents a number from 0 to 10, n represents a number from 5 to 100, a represents an integer from 1 to 3, and when m=0, L+o=2 and R<SUP>2 </SUP>is a bivalent hydrocarbon group, (B) a heat conductive filler, and (C) an organopolysiloxane other than the component (A). Even upon high-level packing with the heat conductive filler to obtain a highly heat conductivity, the composition still exhibits favorable handling and moldability properties
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