PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

A printed circuit board to mount a semiconductor chip with high heat radiation and a method of fabricating the same are provided to reduce manufacturing cost by using a general both sided metal foil laminate. In a printed circuit board to mount a semiconductor chip(320) with high heat radiation, a metal foil(310) is accommodated in an opening unit formed on the printed circuit board and mounts the semiconductor chip(320) on one surface. A heat radiating member is contacted to the metal foil(310) for heat conduction on the other surface of metal foil(310). A silver paste(325) is formed at the upper part of the metal foil(310) to adhere and fix the semiconductor chip(320) on the metal foil(310).