发明名称 RIBBON CABLE IN CMP APPARATUS FOR SEMICONDUCTOR DEVICE MANUFACTURING
摘要 A ribbon cable of a CMP apparatus for manufacturing a semiconductor device is provided to prevent failure in a robot rotating process by forming a protective layer with a rubber material. A ribbon cable of a CMP apparatus for manufacturing a semiconductor device is characterized in that an elastically protective layer(102) is formed at both side regions of a ribbon cable(100). The ribbon cable is formed with a z-axis ribbon cable or a wrist ribbon cable. The protective layer is formed with a rubber material. The protective layer formed with the rubber material having an elastic characteristic is formed on the entire region of the ribbon cable.
申请公布号 KR20060121379(A) 申请公布日期 2006.11.29
申请号 KR20050043511 申请日期 2005.05.24
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK, JUNG MO
分类号 H01L21/304;H01B7/08 主分类号 H01L21/304
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