发明名称 |
RIBBON CABLE IN CMP APPARATUS FOR SEMICONDUCTOR DEVICE MANUFACTURING |
摘要 |
A ribbon cable of a CMP apparatus for manufacturing a semiconductor device is provided to prevent failure in a robot rotating process by forming a protective layer with a rubber material. A ribbon cable of a CMP apparatus for manufacturing a semiconductor device is characterized in that an elastically protective layer(102) is formed at both side regions of a ribbon cable(100). The ribbon cable is formed with a z-axis ribbon cable or a wrist ribbon cable. The protective layer is formed with a rubber material. The protective layer formed with the rubber material having an elastic characteristic is formed on the entire region of the ribbon cable.
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申请公布号 |
KR20060121379(A) |
申请公布日期 |
2006.11.29 |
申请号 |
KR20050043511 |
申请日期 |
2005.05.24 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK, JUNG MO |
分类号 |
H01L21/304;H01B7/08 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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