发明名称 BALLMAP GENERATION METHOD FOR IC PACKAGE
摘要 A ballmap generation method for IC package is provided to generate automatically a ballmap by recording pad numbers of a pad list on the ballmap. An assignment process is performed to assign pad numbers of a pad list to a ballmap(S1). The pad list is defined by a user. A ballmap generation process is carried out to generate automatically the ballmap by using the pad numbers assigned to the ballmap. The assignment process further includes a process for identifying the pad numbers which are not assigned to the ballmap. The ballmap generation process includes a process(S2,S4) for recording the assigned pad numbers and position information to ball number boxes of the pad list, and a process(S5,S6) for recording pad names of the pad list on the corresponding pad number positions of the ballmap.
申请公布号 KR20060121604(A) 申请公布日期 2006.11.29
申请号 KR20050043859 申请日期 2005.05.24
申请人 LG ELECTRONICS INC. 发明人 RYU, MYUNG HWAN;PARK, SUNG HO
分类号 H01L23/00;H01L21/00;H01L21/60 主分类号 H01L23/00
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