| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an insulative wiring board, by which the deposition or the formation of bridges on the outside of a pattern can be suppressed by inactivating an adsorbed chelating agent and at the same time, inhibiting trapping of Au ion and formed Au-nuclei in a substitution or reduction plating method. SOLUTION: The method for manufacturing the insulative wiring board is characterized by performing substitution Au plating by using a cyan-free Au electroless plating liquid for the substitution plating, into which a soluble sulfur-containing organic compound is added, when an insulative wiring board on which a conductive metal pattern is formed is subjected to the substitution Au plating. COPYRIGHT: (C)2007,JPO&INPIT
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