| 摘要 |
A semiconductor device is provided to improve reliability by inserting an under-filling between a substrate and each of semiconductor components. A substrate(1) includes a first surface and a second surface opposite to the first surface along a thickness direction. A first semiconductor component(2) is mounted through a plurality of first bumps having first height on the first surface of the substrate. A second semiconductor component(3) is mounted on the first surface of the substrate through a plurality of second bumps having second height higher than the first height. Different under-fillings(4a,4b) are inserted between the substrate and the first semiconductor component, and between the substrate and the second semiconductor component. |
