| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To markedly improve the strength of connection between a wiring layer and an electrode, and mounting reliability, through a process of devising the shape of an opening provided above the metal wiring layer. <P>SOLUTION: The metal wiring layer 2 is bonded on an insulating board 1, and an organic solvent-soluble resist 3a is formed on the metal wiring layer 2. A resist 3b smaller than the resist 3a is formed on the resist 3a. Thereafter, a substrate protective film 4 is applied and cured, and the resists 3a and 3b are removed by an organic solvent after the substrate protective film 4 is cured, and an opening 4a with a step 4b is provided to the substrate protective film 4 above the metal wiring layer 2. A protrudent electrode electrically connected to the metal wiring layer 2 is provided to the opening 4a. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
