| 摘要 |
PURPOSE:To enhance a heat-dissipating property of a light-emitting device and to enhance its life and reliability by a method wherein a gap between a light-emitting device package and an inner wall of a cylinder part is filled with a solder material. CONSTITUTION:A light-emitting device package 3 is inserted into a cylinder part 2 after a solder part 5 has been installed loosely at its outer periphery; an optical axis is adjusted with reference to x, y and z directions in such a way that it can be used commonly to a SELFOC lens 1. After the optical axis has been adjusted, several parts at the bottom of the cylinder part 2 and the light-emitting device package 3 are fixed by a welding operation by using a YAG laser; a YAG laser welded part 4 is formed. Then, a solder ring situated between an inner wall of the cylinder part 2 and an outer wall of the light- emitting device package 3 is filled by a high-frequency heating operation or the like; a gap between the inner wall of the cylinder member 2 and the light- emitting device package 3 is filled with the solder part 5. Accordingly, a heat- dissipating property of the light-emitting device package 3 is enhanced remarkably; an operating life of a light-emitting device is made long and its reliability is improved. |
