| 摘要 |
An apparatus for polishing wafers and a process for polishing wafers are provided. The apparatus for polishing a wafer which polishes the wafer W held by a carrier plate which rotates around an axis, by pressing and rubbing the wafer to a polishing pad disposed to a polishing platen 12 which rotates around another axis which differs from said axis, in which the polishing pad 11 is equipped with plural areas including a first area 11 a and a second area 11 b having hardness different from each other, each of the first 11 a area and second area 11 b being formed at a distribution and/or an area ratio such that the rate of the time or distance that the wafer W passes through the first area 11 a during polishing to the time or distance that the wafer W passes through the second area 11 b during polishing becomes a predetermined value.
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