| 发明名称 |
Polyamide molding compositions |
| 摘要 |
A thermoplastic molding composition comprising polyamide is disclosed. The composition that contains vinyl (co)polymer and an optional solvent is useful in application where inhibited crystallization of polyamide is desirable, including laser-welding. |
| 申请公布号 |
US7138080(B2) |
申请公布日期 |
2006.11.21 |
| 申请号 |
US20040850912 |
申请日期 |
2004.05.21 |
| 申请人 |
BAYER MATERIALSCIENCE AG |
发明人 |
ULRICH RALPH;JOACHIMI DETLEV |
| 分类号 |
B28B3/20;B29C47/00;B29C49/00;B29C51/00;B29C65/00;B29C65/16;C08L39/04;C08L39/06;C08L77/00;C08L77/02;C08L77/06 |
主分类号 |
B28B3/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
